01

Thermal Oxidation :
Wet & Dry Processes

PE-TEOS, LPCVD(SiN), PE-CVD(SiO2), PE-CVD(SiN)

02

Metal Deposition

Deposition of metals such as Al, Ti, Au, Ni, and Cu onto the wafer surface

03

Wafer Thinning

Customized wafer thickness adjustment to meet diverse application requirements

04

Cleaning & Polishing

Capable of providing single-side or double-side polishing, as well as customized cleaning processes tailored to customer requirements

05

Sawing

Capable of precision wafer sawing tailored to customer requirements