Major Wafer Processing Services

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Polishing : High-planarization and ultra-fine surface processing

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Thermal Oxidation : Formation of insulating oxide layers and compatibility with post-process steps
(PE-TEOS / LPCVD (SiN) / PE-CVD (SiO₂) / PE-CVD (SiN) wafers)

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Back Grinding : Wafer thinning processes

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Customized wafer thickness, from ultra-thin to thick wafers

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Dicing : High-precision wafer cutting processes

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Test & Reclaimed Wafer Supply : Cost-effective solutions for process testing and yield optimization

Customized Processing Support

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Engineering support and specification adjustments tailored to customer products and production processes

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Flexible manufacturing system capable of handling small-lot, multi-product orders as well as high-volume mass production

With our total wafer processing solutions, BNP empowers customers to enhance both productivity and quality assurance.