Reclaim-wafer
Reclaimed Wafers are processed from test wafers previously used in semiconductor manufacturing.
Through steps such as cleaning, polishing, and inspection, they are reconditioned for reuse. They can be supplied in a variety of thicknesses, surface qualiti
Through steps such as cleaning, polishing, and inspection, they are reconditioned for reuse. They can be supplied in a variety of thicknesses, surface qualiti
| Description | Specification |
|---|---|
| Size | 2~12 inch |
| Thickness | Thickness inquiries available |
| Orientation | <100> or <111> |
| Type / Dopant | P-type / N-type (Boron, Phosphorus, Arsenic) |
| Resistivity | 1~10 Ω·cm (or requested specifications) |
| Surface Finish | SSP, DSP |
| Particle Level | ≤ 50 @ ≥0.3 μm |
| TTV (Total Thickness Variation) | ≤ 5 μm |
| Bow / Warp | ≤ 30 μm |
본문
| Description | Specification |
|---|---|
| Size | 2~12 inch |
| Thickness | Thickness inquiries available |
| Orientation | <100> or <111> |
| Type / Dopant | P-type / N-type (Boron, Phosphorus, Arsenic) |
| Resistivity | 1~10 Ω·cm (or requested specifications) |
| Surface Finish | SSP, DSP |
| Particle Level | ≤ 50 @ ≥0.3 μm |
| TTV (Total Thickness Variation) | ≤ 5 μm |
| Bow / Warp | ≤ 30 μm |
- PrevSilicon-wafer 25.09.04
- NextGlass-wafer 25.09.04